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Application Engineer at Applied Materials - ApplyBlast

Application Engineer

Applied Materials

1 month ago

3.9 on Glassdoor

Benicia, California, United States

Onsite

Full Time

Medior

0 applicants

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About this role

This role focuses on developing fault isolation methodologies for XADA technology, working closely with customers and engineering teams to optimize workflows for die-level fault localization and semiconductor failure analysis. The position requires technical expertise and hands-on laboratory experience to drive the adoption of XADA in advanced semiconductor applications. Key activities include leading customer technical reviews, defining application support plans, and transferring new capabilities to customer teams.

Responsibilities

Develop and optimize workflows for die-level fault localization and semiconductor failure analysis
Lead execution teams at customer sites for beta-sites, evaluations, and demonstrations
Interface with customers to analyze technical requirements and define application support plans

Skills

Qualifications

M.S. in Electrical EngineeringM.S. in Materials ScienceM.S. in PhysicsPh.D. in Electrical EngineeringPh.D. in Materials Science

About Applied Materials

appliedmaterials.com

Headquarters

Santa Clara, California, United States

Company Size

10001+ employees

Founded

1967

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Applied Materials is a global leader in materials engineering solutions that enable the production of virtually every new semiconductor chip and advanced display. The company designs, manufactures and services equipment, software and process technologies across semiconductor fabrication (deposition, etch, implantation, inspection/metrology, CMP, ALD/CVD/PVD), advanced packaging and display manufacturing. Its customers include chipmakers, foundries and display manufacturers worldwide, and it provides process integration, factory automation and lifecycle services to improve yield, performance and cost. Headquartered in Santa Clara, California, Applied Materials combines deep R&D and scale to drive device scaling, energy efficiency and new architectures.