Applications Engineer for Advanced Packaging

This role provides pre- and post-sales technical support to customers integrating Wolfspeed SiC substrates into 2.5D and 3D packaging architectures for high-performance computing and AI data center applications. The ideal candidate will act as a technical bridge between Wolfspeed's materials expertise and customer package designs, guiding use-case identification, material selection, and design validation. The position also involves generating new SiC application ideas, co-designing next-generation architectures with partners, and supporting product launches with training and technical documentation.