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Die Attach / Die Bond Equipment Engineer at Nexperia - ApplyBlast

Die Attach / Die Bond Equipment Engineer

Nexperia

3 months ago

3.6 on Glassdoor

Seremban, Negeri Sembilan, Malaysia

Onsite

Full Time

Medior

0 applicants

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About this role

The role is responsible for maintaining and improving Die Attach and Die Bond equipment in a semiconductor manufacturing environment, ensuring high machine uptime, product quality, and smooth production. The engineer will perform preventive maintenance, troubleshoot issues, support new product introductions, and collaborate with production, quality, and process engineering teams.

Responsibilities

Support and maintain Die Attach and Die Bond machines
Troubleshoot and resolve equipment issues to minimize downtime
Perform preventive maintenance and equipment inspections
Monitor equipment performance and drive improvement activities
Support machine setup, qualification, and new product introductions

Skills

Qualifications

Bachelor's Degree in Mechanical, Electrical, Electronics, Mechatronics, Manufacturing Engineering or related field

About Nexperia

nexperia.com

Headquarters

Nijmegen, Gelderland, Netherlands

Company Size

10001+ employees

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Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States.