Die Attach TD Module Engineer

Intel(1 month ago)

Malaysia, Kulim, MalaysiaOnsiteFull TimeMedior$98,245 - $132,261 (estimated)Process Development Engineering

About this role

Package Module Development Engineer focused on Thermal Compression Bonding die attach within Intel Foundry’s Advanced Packaging Technology and Manufacturing – Technology Development (APTM-TD) initiative in Asia. The role supports new product introduction and scaling of advanced packaging process modules from development into high-volume manufacturing, based in Kulim, Malaysia. It operates within a global factory network supporting leading-edge silicon process and packaging technology for foundry customers.

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Required Skills

Process Development
NPI
Thermal Compression Bonding
Die Attach
Advanced Packaging
Process Characterization
Design Of Experiments
Statistical Analysis
Data Analytics
Process Control

+9 more

Qualifications

BS in Engineering
MS in Engineering
PhD in Engineering

About Intel

intel.com

Intel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.

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