Die Bond & Wire Bond Process Equipment Engineer (R2R Assembly Line)
Nexperia(1 month ago)
About this role
A Process Engineer focused on Die Attach and Wire Bond stations within a reel-to-reel semiconductor assembly line. The role centers on ensuring equipment performance, process stability, yield, and quality in a high-volume manufacturing environment. The engineer serves as a technical owner and cross-functional collaborator supporting product introductions and continuous improvement.
Required Skills
- Die Bond
- Wire Bond
- R2R Assembly
- Equipment Setup
- Calibration
- Troubleshooting
- DOE
- FMEA
- SPC
- 8D
+12 more
Qualifications
- BS in Engineering
About Nexperia
nexperia.comHeadquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States.
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