Process Engineer - Die Bond & Wire Bond
Lumentum Japan, Inc.(1 year ago)
About this role
A Process Engineer responsible for supporting manufacturing of semiconductor and opto-electronic products by enabling robust, scalable processes (with emphasis on die bond and wire bond). The role partners with R&D, product engineering and product line management to ensure process readiness, quality compliance and production improvements. The position requires global collaboration and occasional international travel.
Required Skills
- Process Optimization
- Process Assessment
- DOE
- SPC
- Process Simulation
- Risk Assessment
- Process Documentation
- Problem Solving
- Project Management
- Leadership
+2 more
Qualifications
- Bachelors in Engineering or Science
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