Die Bond & Wire Bond Process Equipment Engineer (R2R Assembly Line)
Nexperia(26 days ago)
About this role
An engineer responsible for end-to-end ownership of Die Attach and Wire Bond processes and equipment in a Reel-to-Reel semiconductor assembly line. The role focuses on ensuring high equipment uptime, process stability, yield improvement, and supporting new product introductions while collaborating across cross-functional teams.
Required Skills
- Die Bond
- Wire Bond
- R2R
- Equipment Setup
- Calibration
- Troubleshooting
- DOE
- FMEA
- SPC
- Root Cause
+7 more
Qualifications
- BS in Mechanical Engineering
- BS in Electrical Engineering
- BS in Electronics Engineering
- BS in Mechatronics Engineering
About Nexperia
nexperia.comHeadquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States.
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