Die Bond & Wire Bond Process Equipment Engineer (R2R Assembly Line)
Nexperia
About this role
An engineer responsible for end-to-end ownership of Die Attach and Wire Bond processes and equipment in a Reel-to-Reel semiconductor assembly line. The role focuses on ensuring high equipment uptime, process stability, yield improvement, and supporting new product introductions while collaborating across cross-functional teams.
Skills
Qualifications
About Nexperia
nexperia.comHeadquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States.
Recent company news
SourceabilityChip industry hit by Nexperia export ban
3 days ago
ReutersNexperia China says it has begun producing its own chips
3 days ago
EvertiqNexperia dispute deepens as China unit launches independent chip production
2 days ago
The American BazaarNexperia China says it has begun producing its own chips
2 days ago
Automotive NewsNexperia owner to seek $8 billion compensation in semiconductor showdown as Dutch block China control
1 week ago
About Nexperia
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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View leadership team, funding history,
and employee contacts for Nexperia.
Salary
$61k – $83k
per year