ApplyBlast uses AI to match you with the right jobs, tailor your resume and cover letter, and apply automatically so you can land your dream job faster.
© All Rights Reserved. ApplyBlast.com
ApplyBlast uses AI to match you with the right jobs, tailor your resume and cover letter, and apply automatically so you can land your dream job faster.
© All Rights Reserved. ApplyBlast.com
Amkor Technology
A BU Product Management role at Amkor focused on program management and customer account management for Advanced Chiplets/FCBGA Packaging. The role involves driving internal process development, supporting customer and supplier development, and managing the qualification and mass production of Chiplets/FCBGA products.
Headquarters
Tempe, Arizona, United States
Company Size
10001+ employees
Founded
1968
World's largest US-based semiconductor packaging & test services provider. Advanced OSAT solutions for global chip manufacturers.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Amkor Technology.
Amkor Technology didn’t post a salary, so this is our estimate from similar listings.
Director, Chiplets/FCBGA Integration
GovernmentJobs
Director, Chiplets/FCBGA BU
GovernmentJobs
Principal Engineer – Advanced IC Packaging
powerlattice
Senior Engineer Technology Development Kulim Malaysia
infineon
Staff Engineer Technology Development Kulim Malaysia
infineon
Process Engineer - Wafer Characterization SQE
Micron Technology