Amkor Technology
Amkor Technology is seeking an IC Package Design Engineer to develop high-quality IC package designs and create detailed engineering drawings. The role involves collaborating with internal teams and customers to deliver package solutions that meet thermal, mechanical, electrical, and manufacturing requirements. The engineer will analyze design challenges, improve methodologies, and maintain accurate engineering records.
Headquarters
Tempe, Arizona, United States
Company Size
10001+ employees
Founded
1968
World's largest US-based semiconductor packaging & test services provider. Advanced OSAT solutions for global chip manufacturers.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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Amkor Technology didn’t post a salary, so this is our estimate from similar listings.