Director %E2%80%93 Package Materials Integration Aptd Boise Idaho United States Of America

A Director of Package Materials Integration at Micron leads the strategy and execution for advanced packaging materials roadmaps for 3D memory products like HBM and DRAM. This role involves managing a global team across the U.S. and Asia, driving supplier engagement, and resolving critical materials-package interaction issues to support high-volume manufacturing. The position requires deep expertise in semiconductor process integration and the ability to partner with cross-functional engineering teams to define optimum package solutions.