Renesas 瑞萨电子
The Staff Package Development Engineer at Renesas is responsible for developing, qualifying, and industrializing semiconductor package solutions, ensuring they meet performance, reliability, manufacturability, cost, and schedule requirements. The role collaborates with cross‑functional teams and OSAT partners to advance new package technologies from concept to high‑volume production.
作为全球领先的微控制器、模拟功率器件和SoC产品供应商,瑞萨电子通过提供可靠的创新嵌入式设计,与您共创无限未来。
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Renesas 瑞萨电子.
Renesas 瑞萨电子 didn’t post a salary, so this is our estimate from similar listings.
6% below the average for this role
Process Integrator for Advanced Package Assembly for Heterogeneous Integration
ASTARPRD
Advanced Packaging Process Engineer
Micron Technology
Senior Process Engineer
meshopticaltechnologies.com
Production Process Engineer
Jabil
Research Engineer / Senior Research Engineer
ASTARPRD
Senior NPI Packaging Engineer
Murata