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Director, Package Design Engineering at Renesas 瑞萨电子 - ApplyBlast

Director, Package Design Engineering

Renesas 瑞萨电子

2 months ago

San Jose, California, United States

Onsite

Full Time

Director

0 applicants

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About this role

The Director, Package Design Engineering leads the development of advanced packaging technologies for power and AI/datacenter applications, overseeing R&D, global OSAT management, and technology roadmaps. This senior role is responsible for guiding new package qualification, process integration, and ensuring high‑quality production transitions while collaborating with product, reliability, and operations teams.

Responsibilities

Develop and qualify new power package technologies
Manage global OSAT partners and production ramp‑up
Lead packaging roadmap, budget, and customer adoption programs

Skills

Qualifications

Doctorate in Physics, Chemistry, Mechanical, Electrical or Materials EngineeringMaster's Degree in Physics, Chemistry, Mechanical, Electrical or Materials EngineeringBachelor's Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering