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© All Rights Reserved. ApplyBlast.com
ASTARPRD
The Advanced Packaging Program at the Institute of Microelectronics is seeking a Scientist or Senior Scientist to lead the development of advanced chip-to-wafer and chip-to-chip bonding technologies for heterogeneous integration. This role involves creating assembly process integration flows for 2.5D interposers and 3D chip stacking, while collaborating with cross-functional teams to define technology roadmaps and drive innovation. The position requires expertise in semiconductor package assembly processes and a strong background in research and development.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for ASTARPRD.
ASTARPRD didn’t post a salary, so this is our estimate from similar listings.
15% below the average for this role