Director – Package Materials Integration, APTD

As a Director of Package Materials Integration, you will lead the strategy and execution for Micron's advanced packaging materials roadmap for 3D memory products like HBM and 3DS DRAM. You will manage a global team, drive supplier engagement, and resolve critical materials-package interaction issues to meet development timelines. This role requires deep expertise in semiconductor materials, heterogeneous integration technologies, and leading cross-functional technical teams globally.