DRAM Process Integration Engineer
micron
About this role
A Process Integration Engineer in the 3D DRAM organization at Micron works in a 300mm R&D facility focusing on the performance and manufacturability of next-generation 3D DRAM memory technologies. The role emphasizes semiconductor device physics and integration/circuit issues specific to 3D DRAM and supports advancement of memory scaling through cross-functional collaboration with engineering and development teams.
Skills
Qualifications
About micron
micron.comMicron Technology, Inc. is a global leader in semiconductors. It provides a broad range of performance-enhancing memory and storage solutions. Headquartered in Boise, Idaho, Micron serves customers worldwide with its memory and storage products. The company is recognized for its global reach and leadership in the semiconductor industry.
About micron
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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and employee contacts for micron.
Salary
$189k – $253k
per year
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