Senior Process Engineer - Advanced Packaging
ASM
About this role
A Senior Process Engineer 3D Integration/Advanced Packaging at ASM will be based in the Corporate Research & Development team in Helsinki, working to advance semiconductor process technologies. The role focuses on developing and maturing thin-film and atomic layer deposition (ALD) technologies for 3D integration and advanced packaging to support next-generation semiconductor applications. The position contributes to cross‑functional R&D efforts and global product innovations that enable customers' semiconductor solutions.
Skills
Qualifications
About ASM
asm.comASM is a leading semiconductor-equipment company that builds machines enabling the production of smaller, more advanced chips. The company specializes in high‑precision deposition and wafer processing technologies (such as atomic layer deposition, epitaxy and related CVD processes), plus process integration and automation used by foundries and fabs. Combining intensive R&D, systems engineering and global service, ASM delivers high‑throughput, high‑accuracy tools that help chipmakers scale nodes, improve yield and accelerate innovation.
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About ASM
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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View leadership team, funding history,
and employee contacts for ASM.
Salary
$178k – $238k
per year
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