Senior Process Engineer - Advanced Packaging

ASM(7 days ago)

Helsinki, Finland, FinlandOnsiteFull TimeSenior$177,723 - $237,840 (estimated)Research and Development

About this role

A Senior Process Engineer 3D Integration/Advanced Packaging at ASM will be based in the Corporate Research & Development team in Helsinki, working to advance semiconductor process technologies. The role focuses on developing and maturing thin-film and atomic layer deposition (ALD) technologies for 3D integration and advanced packaging to support next-generation semiconductor applications. The position contributes to cross‑functional R&D efforts and global product innovations that enable customers' semiconductor solutions.

View Original Listing

Required Skills

ALD
Epitaxy
PEALD
PECVD
Vertical Furnaces
CVD
XPS
AFM
Ellipsometry
XRD

+11 more

Qualifications

PhD in Physics, Chemistry, Chemical Engineering or Materials Science

About ASM

asm.com

ASM is a leading semiconductor-equipment company that builds machines enabling the production of smaller, more advanced chips. The company specializes in high‑precision deposition and wafer processing technologies (such as atomic layer deposition, epitaxy and related CVD processes), plus process integration and automation used by foundries and fabs. Combining intensive R&D, systems engineering and global service, ASM delivers high‑throughput, high‑accuracy tools that help chipmakers scale nodes, improve yield and accelerate innovation.