Lockheed Martin
The ElectroMechanical Design Engineer pioneers 2D/3D heterogeneous packaging concepts for aerospace and defense missions, integrating thin film, semiconductor, and thermal management technologies. This role involves designing, prototyping, and testing cutting-edge packaging solutions while collaborating with cross-functional engineering teams. The position offers hands-on experience with emerging semiconductor manufacturing processes and mentorship from senior subject matter experts.
Headquarters
Bethesda, Maryland, United States
Company Size
10001+ employees
Founded
1912
Lockheed Martin is a global security, defense, and aerospace company headquartered in Bethesda, Maryland, with roughly 116,000 employees and 370+ facilities worldwide. It designs, develops, and manufactures integrated systems and technologies — from fighter and rotary-wing aircraft to missile systems, missile defense, space and satellite platforms, sensors, and cyber/ISR solutions — for governments and allied partners. The company emphasizes advanced R&D, systems integration, and production to deliver mission-ready capabilities across air, land, sea, space, and cyberspace, supported by a broad domestic and international supplier base. Customers rely on Lockheed Martin for large-scale engineering expertise, program management, and lifecycle sustainment of complex defense and space programs.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Lockheed Martin.
33% above the average for this role
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