SMTS Integration Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)

GlobalFoundries(7 months ago)

SingaporeOnsiteFull TimeSenior$157,519 - $211,793 (estimated)Engineering

About this role

GlobalFoundries is hiring an SMTS Integration Engineer to lead its Advanced Packaging Program focused on 2.5D and 3D heterogeneous integration. The role centers on driving next-generation semiconductor packaging solutions by coordinating efforts across engineering and manufacturing stakeholders within a global semiconductor foundry environment.

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Required Skills

Advanced Packaging
Integration Engineering
2.5D Packaging
3D Integration
Heterogeneous Integration
Interposer Design
TSV
Die Stacking
Thermal Management
SiP

+8 more

Qualifications

BS in Electrical Engineering
MS in Electrical Engineering
BS in Materials Science
MS in Materials Science
BS in Mechanical Engineering
MS in Mechanical Engineering

About GlobalFoundries

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GlobalFoundries is a leading semiconductor manufacturing firm that specializes in providing advanced technology solutions to a global clientele. The company facilitates seamless collaboration through its GF Connect platform, allowing customers to manage orders and get to production more efficiently. With a commitment to innovation and quality, GlobalFoundries plays a crucial role in the semiconductor supply chain, delivering cutting-edge manufacturing capabilities for various industries.

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