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SMTS Integration Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration) at GlobalFoundries - ApplyBlast

SMTS Integration Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)

GlobalFoundries

1 year ago

3.5 on Glassdoor

Singapore

Onsite

Full Time

Senior

0 applicants

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About this role

GlobalFoundries is hiring an SMTS Integration Engineer to lead its Advanced Packaging Program focused on 2.5D and 3D heterogeneous integration. The role centers on driving next-generation semiconductor packaging solutions by coordinating efforts across engineering and manufacturing stakeholders within a global semiconductor foundry environment.

Skills

Qualifications

BS in Electrical EngineeringMS in Electrical EngineeringBS in Materials ScienceMS in Materials ScienceBS in Mechanical Engineering

About GlobalFoundries

gf.com

Headquarters

Malta, New York, United States

Company Size

10001+ employees

Founded

2009

View Profile

GlobalFoundries is a leading semiconductor manufacturing firm that specializes in providing advanced technology solutions to a global clientele. The company facilitates seamless collaboration through its GF Connect platform, allowing customers to manage orders and get to production more efficiently. With a commitment to innovation and quality, GlobalFoundries plays a crucial role in the semiconductor supply chain, delivering cutting-edge manufacturing capabilities for various industries.