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© All Rights Reserved. ApplyBlast.com
The Aerospace Corporation
An Electronics Parts, Materials, and Processes Engineer - Advanced Packaging at The Aerospace Corporation focuses on semiconductor packaging, assembly, and testing for space and missile applications. The role involves technical consultation, program management, and collaboration with industry experts.
Headquarters
Chantilly, Virginia, United States
Company Size
1001-5000 employees
Founded
1960
Aerospace operates the only federally funded research and development center (FFRDC) committed exclusively to the space enterprise. Our technical experts span every discipline of space-related science and engineering.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for The Aerospace Corporation.
17% above the average for this role
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