ApplyBlast uses AI to match you with the right jobs, tailor your resume and cover letter, and apply automatically so you can land your dream job faster.

Features

Auto Apply Resume Optimizer Cover Letter Optimizer Interview Prep

Company

Social Media

Need Help?

team@applyblast.com

Embedded Software Engineer at Kandou AI (formerly Kandou Bus) is a semiconductor company on a mission to democratize Artificial Intelligence by delivering affordable, scalable, and energy-efficient AI hardware solutions. Powered by their proprietary Copper MIMO interconnect technology, they provide chiplet-based AI fabric solutions across GPU, Memory, Network, and Rack connectivity. Their products enable customers worldwide to build massively scalable AI systems at significantly reduced cost. - ApplyBlast

Embedded Software Engineer

Kandou AI (formerly Kandou Bus) is a semiconductor company on a mission to democratize Artificial Intelligence by delivering affordable, scalable, and energy-efficient AI hardware solutions. Powered by their proprietary Copper MIMO interconnect technology, they provide chiplet-based AI fabric solutions across GPU, Memory, Network, and Rack connectivity. Their products enable customers worldwide to build massively scalable AI systems at significantly reduced cost.

4 months ago

Hyderabad, Telangana

Onsite

Contract

Senior

0 applicants

View Job Listing

Apply to 100+ jobs

About this role

Kandou is seeking an Embedded Software Engineer to design, code, and debug real-time firmware for its proprietary AI memory fabric and ASIC products. The role involves working with RISC-V architectures, heterogeneous multicores, and high-speed signaling technologies to optimize hardware performance for AI training and inference. Candidates will lead board bring-up, develop bootloaders, and collaborate with architects to implement firmware updates and diagnostics for the next generation of AI infrastructure.

Responsibilities

Develop and maintain real-time embedded firmware for new AI ASIC products
Design and debug RTOS-based firmware targeting RISC-V heterogeneous cores
Lead board and SoC bring-up using JTAG and other debug mechanisms
Implement firmware updates, bootloaders, and secure boot mechanisms
Interface with high-speed signaling technologies like PCIe and CXL for link training

Skills

About Kandou AI (formerly Kandou Bus) is a semiconductor company on a mission to democratize Artificial Intelligence by delivering affordable, scalable, and energy-efficient AI hardware solutions. Powered by their proprietary Copper MIMO interconnect technology, they provide chiplet-based AI fabric solutions across GPU, Memory, Network, and Rack connectivity. Their products enable customers worldwide to build massively scalable AI systems at significantly reduced cost.

kandou.com

We enable faster and more energy efficient interconnects with a smaller physical footprint than competing technologies. Our chip connection technologies improves the speed to power consumption trade-off frontier.

About Kandou AI (formerly Kandou Bus) is a semiconductor company on a mission to democratize Artificial Intelligence by delivering affordable, scalable, and energy-efficient AI hardware solutions. Powered by their proprietary Copper MIMO interconnect technology, they provide chiplet-based AI fabric solutions across GPU, Memory, Network, and Rack connectivity. Their products enable customers worldwide to build massively scalable AI systems at significantly reduced cost.

Headquarters

San Francisco, CA

Company Size

201-500 employees

Founded

2018

Industry

Technology

Glassdoor Rating

4.2 / 5

Leadership Team

Sarah Johnson

Chief Executive Officer

Michael Chen

Chief Technology Officer

Emily Williams

VP of Engineering

David Rodriguez

VP of Product

Jessica Thompson

Chief Financial Officer

Andrew Park

VP of Sales

Unlock Company Insights

View leadership team, funding history,
and employee contacts for Kandou AI (formerly Kandou Bus) is a semiconductor company on a mission to democratize Artificial Intelligence by delivering affordable, scalable, and energy-efficient AI hardware solutions. Powered by their proprietary Copper MIMO interconnect technology, they provide chiplet-based AI fabric solutions across GPU, Memory, Network, and Rack connectivity. Their products enable customers worldwide to build massively scalable AI systems at significantly reduced cost..

Reveal Company Insights