Kandou
The Firmware Lead at Kandou leads the implementation and delivery of real-time embedded firmware for the Randa 1.6T Active Electrical Cable platform, focusing on high-performance, energy-efficient AI infrastructure. This hands-on technical leadership role involves writing and reviewing C/C++ code, debugging firmware and hardware interactions, and mentoring engineers while driving pre-silicon and post-silicon bring-up. The position requires translating system designs into production code, owning implementation quality, and collaborating across architecture, ASIC, and validation teams.
Kandou AI develops revolutionary Copper MIMO (Chord Signaling) interconnect technology that unlocks the full potential of copper links for AI infrastructure. Their technology reimagines how memory, compute, and rack-scale connectivity work together, delivering over 10X lower cost, 3X lower power, and 8X more scale compared to traditional approaches. Kandou's products span PCIe retimers, USB4 retimers, PCIe switches, and chiplet interconnect IP targeting AI inference, CXL memory platforms, and high-speed networking applications.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Kandou.
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Kandou AI (formerly Kandou Bus) is a semiconductor company on a mission to democratize Artificial Intelligence by delivering affordable, scalable, and energy-efficient AI hardware solutions. Powered by their proprietary Copper MIMO interconnect technology, they provide chiplet-based AI fabric solutions across GPU, Memory, Network, and Rack connectivity. Their products enable customers worldwide to build massively scalable AI systems at significantly reduced cost.
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