Equipment Development Engineer – Wafer Bonding

Micron Technology is seeking an Equipment Development Engineer to lead the development of next-generation wafer bonding equipment, taking new ideas from concept to hardware and manufacturing implementation. The role involves collaborating with suppliers and cross-functional teams to solve complex equipment challenges, improve system capabilities, and define the equipment roadmap for future technology generations. This hands-on position requires technical ownership of equipment performance, reliability, and productivity while driving innovation in precision alignment, overlay, and bonding processes.