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© All Rights Reserved. ApplyBlast.com
ASTARPRD
A Research Scientist is sought to join a multidisciplinary R&D team focused on developing temporary wafer bonding and debonding technologies for next-generation semiconductor packaging. The role involves transforming research ideas into robust manufacturing solutions for 3D ICs, chiplets, and heterogeneous integration. This position offers an opportunity to work on enabling technologies that advance wafer-level packaging and semiconductor assembly.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for ASTARPRD.
ASTARPRD didn’t post a salary, so this is our estimate from similar listings.
15% below the average for this role
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