HBM Memory Subsystem Architect – Principal Engineer
micron
About this role
Micron Technology is seeking an experienced Memory Subsystem Architect to lead the development of next-generation high-bandwidth memory (HBM) products. The role involves designing innovative memory architectures and collaborating with cross-functional teams and industry partners to support AI/ML solutions.
Skills
About micron
micron.comMicron Technology, Inc. is a global leader in semiconductors. It provides a broad range of performance-enhancing memory and storage solutions. Headquartered in Boise, Idaho, Micron serves customers worldwide with its memory and storage products. The company is recognized for its global reach and leadership in the semiconductor industry.
About micron
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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Salary
$162k – $344k
per year