HBM SoC Physical Design Engineer

As a SoC Physical Design Engineer in the Heterogeneous Integration Group at Micron, you will drive the implementation of advanced HBM SoC logic and base die designs from netlist to GDSII. This hands-on role involves closely collaborating with RTL design, verification, packaging, and manufacturing teams to deliver best-in-class performance, power, and area metrics. You will own physical implementation tasks including floor-planning, routing, and timing closure while ensuring designs meet robust signoff collateral requirements for tape-out.