Qualcomm Incorporated
The Central Hardware Systems Team at Qualcomm is seeking an IC Package Design Engineer to lead road mapping, architecture, and implementation for all package products. This role involves physical design, layout optimization, and verification while collaborating with multi-functional teams to ensure optimal mechanical, electrical, RF, and thermal performance. The engineer will also drive methodology innovations, evaluate new CAD tools, and work with marketing teams on competitive analysis for future technologies.
Headquarters
San Diego, California, United States
Company Size
10001+ employees
Founded
1985
Qualcomm is a global semiconductor and telecommunications company that designs wireless technologies and platform solutions, best known for its Snapdragon mobile SoCs, 5G modems, and RF front‑end components. The company focuses on high‑performance, low‑power computing and on‑device AI, as well as unrivaled connectivity to enable smartphones, automotive systems, XR, IoT, and edge applications. Qualcomm pairs chip design and system software with extensive patent licensing and a broad OEM/developer ecosystem to accelerate industry transformation through 5G, AI, and “intelligent computing everywhere.”
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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Qualcomm Incorporated didn’t post a salary, so this is our estimate from similar listings.
32% below the average for this role