IC Package Design Engineer

Claros(13 days ago)

HybridFull TimeSenior$155,000 - $190,000Hardware Engineering

About this role

Claros is seeking an IC Package Layout Engineer to design and optimize advanced IC package substrates for high-performance semiconductor products. The role focuses on delivering manufacturable package solutions that meet strict electrical, mechanical, and reliability requirements while collaborating with cross-functional teams. The position reports to the CTO and supports Claros' mission to improve power delivery and efficiency for AI-focused data center infrastructure.

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Required Skills

Package Layout
Cadence APD
SI/PI
DRC/DFM
Cam350
AutoCAD
BGA Packaging
Stack-Up
Ball Mapping
Routing

+2 more

Qualifications

Bachelor's Degree in Electrical Engineering or Computer Engineering

About Claros

clarostechnologies.com

Claros Technologies is an environmental technology company focused on detecting and permanently destroying PFAS (“forever chemicals”). Their systems claim permanent destruction of 99.99% of long-, short- and ultra‑short‑chain PFAS while delivering high flow at low cost. Claros offers integrated detection and destruction solutions—designed for remediation, industrial effluent, and municipal water applications—to help organizations meet tightening regulatory requirements. Their mission is summed up by the tagline: “We Destroy PFAS for Good.”