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© All Rights Reserved. ApplyBlast.com
HCL Group
The role seeks an experienced IC Package Design Engineer with over 8 years of expertise in Cadence Advanced Package Designer and package/substrate design, including flip chip, BGA ball map assignment, and high‑speed interface layouts. The candidate will work on complex package technologies such as MCM, 3D/2.5D, and ensure compliance with PDN, SI/PI, DFM, and DFA requirements while delivering multiple tape‑out projects.
HCL Group is a pioneering Indian conglomerate established in 1976, recognized as one of India's original IT garage start-ups and an early innovator in modern computing. The Group operates a portfolio of companies spanning technology services (HCLTech), software products (HCLSoftware), healthcare solutions (HCL Healthcare), IT distribution (HCL Infosystems), and online education (HCL GUVI). It also invests in philanthropy, sports, and music through various strategic programs and foundations.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for HCL Group.