Intern - Advanced Packaging TD
micron
About this role
As an Advanced Package TD Process Intern at Micron Technology, you will collaborate with experienced engineers to support the development of advanced interconnect technologies such as hybrid bonding and microbump technology. This internship offers hands-on experience in problem-solving, line monitoring, data analysis, and project management, contributing directly to yield improvement and process optimization.
Skills
About micron
micron.comMicron Technology, Inc. is a global leader in semiconductors. It provides a broad range of performance-enhancing memory and storage solutions. Headquartered in Boise, Idaho, Micron serves customers worldwide with its memory and storage products. The company is recognized for its global reach and leadership in the semiconductor industry.
About micron
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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and employee contacts for micron.
Salary
$63k – $86k
per year
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