Internship – Thermal Analysis (IC Design flow)
NXP Semiconductors(2 months ago)
About this role
A full-time 9+ month internship in NXP’s Design Enablement - Digital team (CTO) focused on investigating and enhancing IC design analysis by including thermal effects on power and power grid. The role offers hands-on work with representative NXP design test cases, automation of design flows, and opportunities for professional development and entry into NXP’s Young Professional Talent Pool.
Required Skills
- EDA Tools
- IC Design
- PCB Design
- Thermal Analysis
- Electromigration
- IR Drop
- Substrate Noise
- Automation
- Linux
- Python
Qualifications
- BSc in Microelectronics
- MSc in Microelectronics
- CEFR B2 English
- Enrollment as Student
About NXP Semiconductors
nxp.comNXP is a global semiconductor company creating solutions that enable secure connections for a smarter world.
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