IC Package Design Engineer
Red Cell Partners(13 days ago)
About this role
An IC Package Design Engineer at Claros contributes to the development of advanced IC package substrates for high-performance semiconductor products within a company focused on Grid-to-Chip power solutions for next-generation data centers. The role is based in Torrance, CA, reports to the CTO, and operates in a hybrid schedule supporting both commercial and government customers.
Required Skills
- Package Layout
- Substrate Design
- Signal Integrity
- Power Integrity
- Stack-Up
- BGA Routing
- Ball Mapping
- DRC/DFM
- Cadence APD
- Cam350
+4 more
Qualifications
- BS in Electrical Engineering
- BS in Computer Engineering
About Red Cell Partners
redcellpartners.comRed Cell Partners is a venture studio and incubation firm that builds, launches, and scales technology-led companies in healthcare, cybersecurity, and national security. It combines capital with operational support, domain expertise, and strategic networks to accelerate early-stage ventures from concept to market. The firm focuses on mission-driven innovation to deliver commercial growth and real-world impact across public and private sectors. Its guiding tagline is “Impact Through Innovation.”
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