Lead the development and qualification of advanced multi-Phase Power Module, DrMOS, and Smart Power Stage (SPS) packages

This role leads the development and qualification of advanced power packaging solutions, including multi-phase power modules, DrMOS, and smart power stages. The position is responsible for defining package architecture, optimizing substrate and flip-chip designs, and ensuring manufacturing readiness. The role involves close collaboration with cross-functional teams and external partners to deliver high-performance, cost-effective solutions.