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© All Rights Reserved. ApplyBlast.com
Oracle
This role leads the development, qualification, and manufacturing release of advanced flip-chip packaging solutions, including substrate-based and leadframe-based technologies. The position involves driving package development from concept through production while collaborating with cross-functional teams, OSATs, and suppliers to deliver high-performance products. It requires strong technical expertise in flip-chip packaging processes and reliability assessment.
Oracle Corporation is a multinational technology company that builds enterprise software, cloud infrastructure, and engineered systems for large organizations. Best known for the Oracle Database, the company also offers a broad portfolio of enterprise applications (ERP, HCM, CX), analytics, middleware, Java, and hardware, plus Oracle Cloud Infrastructure (OCI) with SaaS, PaaS, and IaaS services. Oracle supports customers through consulting, managed services, and global technical support to migrate and modernize mission‑critical systems. Enterprises choose Oracle for its integrated stack, scalable performance, and enterprise‑grade security and reliability.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Oracle.
Oracle didn’t post a salary, so this is our estimate from similar listings.
Right around the average for this role
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