Low-Temperature Bonding Engineer

GlobalFoundries is seeking an R&D Assembly Engineer to develop low-temperature bonding processes and support advanced die assembly technologies for next-generation quantum packaging platforms. The role involves driving process characterization, tool optimization, and defect reduction within the Advanced Packaging and Photonics Center. Engineers will define process windows, execute design of experiments, and collaborate with test and systems teams to ensure hardware meets cryogenic reliability and electrical integrity requirements.