ApplyBlast uses AI to match you with the right jobs, tailor your resume and cover letter, and apply automatically so you can land your dream job faster.
© All Rights Reserved. ApplyBlast.com
ApplyBlast uses AI to match you with the right jobs, tailor your resume and cover letter, and apply automatically so you can land your dream job faster.
© All Rights Reserved. ApplyBlast.com
qorvo
Qorvo is offering a Modeling Engineering Internship within its Global Operations group, providing hands‑on experience with semiconductor assembly processes, simulation techniques, and quality assurance. Interns will receive mentorship, participate in learning events, and present their work to business leaders while gaining exposure to real‑world engineering challenges.
Headquarters
Greensboro, North Carolina, United States
Company Size
5001-10000 employees
Founded
2015
Qorvo is a semiconductor company that designs and manufactures advanced RF and power solutions for mobile, infrastructure, industrial, and defense markets. Its product portfolio includes power amplifiers, RF front‑end modules, filters, antenna tuners, PMICs, SiC/GaN power devices, and sensor technologies that address wireless connectivity, 5G, broadband, radar, and IoT applications. Qorvo positions itself as a systems‑level partner, combining high‑performance components, manufacturing scale, and engineering support to solve complex RF and power challenges for global customers.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for qorvo.
qorvo didn’t post a salary, so this is our estimate from similar listings.
11% below the average for this role
Samsung Austin Semiconductor Internship
Samsung US
Advanced Packaging Modeling Expert - FEA
Applied Materials
Advanced Sample Preparation and AI-Enabled Process Innovation for Transmission Electron Microscopy (TEM) Analysis Internship
Micron Technology
2026 Summer Materials Engineer Co%E2%80%91op Intern Tcad Modeling Doctorate Gloucester Ma Gloucester Ma
Applied Materials
Head of Physics AI - Thermal-Mechanical Reliability
Flexcompute Inc.
Semiconductor Packaging Modeling and Simulation Engineer
Oracle