Module Development Engineer- Hybrid Bonding

Intel(23 days ago)

Oregon, United States, Hillsboro, OROnsiteFull TimeJunior$99,030 - $139,810Manufacturing

About this role

Module Development Engineer at Intel Oregon Advanced Packaging (ORAP) contributes to advancing semiconductor packaging technology and supporting manufacturing excellence. The role focuses on driving technical improvements to equipment and modules to enable high-volume production and ensure product quality. This position requires regular onsite presence at the Hillsboro, OR Ronler Acres facilities.

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Required Skills

Equipment Maintenance
Process Development
Process Control
Data Analysis
Troubleshooting
Product Introduction
Process Optimization
Safety Procedures
MES
SQL

+4 more

Qualifications

MS in Mechanical Engineering
MS in Electrical or Electronic Engineering
MS in Chemical Engineering
MS in Computer Engineering

About Intel

intel.com

Intel Corporation is a global technology company that designs and manufactures advanced integrated digital technology products, including microprocessors, chipsets, and software solutions. With a focus on delivering Artificial Intelligence (AI) at scale, Intel provides comprehensive hardware and software solutions for cloud, data center, edge computing, and client devices. The company is known for its innovation in technologies that power a variety of computing platforms, from personal computers to enterprise solutions, enabling businesses and individuals to realize their full potential.

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