Applied Materials
The role involves developing advanced packaging modules, driving new materials and process development for logic, DRAM, and NAND, and providing domain expertise in various packaging technologies. The candidate will lead cross‑functional projects, define engineering plans, and support intellectual property initiatives while collaborating with internal business units and external customers.
Headquarters
Santa Clara, California, United States
Company Size
10001+ employees
Founded
1967
Applied Materials is a global leader in materials engineering solutions that enable the production of virtually every new semiconductor chip and advanced display. The company designs, manufactures and services equipment, software and process technologies across semiconductor fabrication (deposition, etch, implantation, inspection/metrology, CMP, ALD/CVD/PVD), advanced packaging and display manufacturing. Its customers include chipmakers, foundries and display manufacturers worldwide, and it provides process integration, factory automation and lifecycle services to improve yield, performance and cost. Headquartered in Santa Clara, California, Applied Materials combines deep R&D and scale to drive device scaling, energy efficiency and new architectures.
Applied Materials Inc. (AMAT): Billionaire Ken Fisher Remains Positive on Semis
1 day ago
Applied Materials: The Gate-All-Around Inflection Point Justifies A Strong Buy (AMAT)
1 day ago
Applied Materials and SK Hynix forge R&D partnership in Silicon Valley
2 days ago
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Applied Materials.
23% above the average for this role
CTC Alternative Strategies Ltd. Trims Position in Applied Materials, Inc.
5 hours ago
New Graduate College Candidate
GlobalFoundries
Process Integrator for Advanced Package Assembly for Heterogeneous Integration
ASTARPRD
Manager, Quantum Advanced Packaging
GlobalFoundries
Quantum Assembly Engineer
GlobalFoundries
Advanced Packaging Process Development Engineer - Principal
SkyWater Technology Foundry, Inc.
3D Heterogeneous Integration Design Enablement Engineer (2026 New College Graduate)
GlobalFoundries