Molding Process and Equipment Engineer
Nexperia(3 months ago)
About this role
A senior engineering role at Nexperia focused on semiconductor EMC molding and package equipment support within a high-volume manufacturing environment. The position sits within the manufacturing organization and contributes to advancing packaging technologies and production readiness through cross-functional collaboration.
Required Skills
- EMC Molding
- Compression Molding
- Transfer Molding
- Mold Compounds
- Statistical Analysis
- JMP
- Minitab
- Technical Documentation
- Equipment Maintenance
- Process Validation
+5 more
Qualifications
- Bachelor's Degree in Engineering
About Nexperia
nexperia.comHeadquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States.
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