Principal/Sr Engineer, Advance Packaging Process Engineering
Eightfold(26 days ago)
About this role
A Process Development Engineer role within Micron’s Assembly Package Technology Development team, focused on advancing packaging technologies for memory and storage products. This experienced individual contributor works closely with cross-functional manufacturing and design teams to support innovation from concept through production readiness.
Required Skills
- Process Development
- Package Assembly
- Yield Management
- SPC
- Data Analysis
- JMP
- Flip Chip
- TCB
- CMP
- Wafer Level
+5 more
Qualifications
- Bachelor's or Master's in Electrical Engineering, Materials Science or Physics
About Eightfold
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