MRDA ENGINEER, ADVANCED PACKAGING TECHNOLOGY DEVELOPMENT
micron
About this role
As a Metrology Realtime Defect Analysis Engineer in the Advanced Packaging Technology Development department at Micron Technology, you will be pivotal in managing critical dimension metrology and defect analysis within advanced IC packaging projects. The role requires exceptional analytical and statistical skills to facilitate the transition of inspection processes to support technology roadmaps and optimize manufacturing operations.
Skills
Qualifications
About micron
micron.comMicron Technology, Inc. is a global leader in semiconductors. It provides a broad range of performance-enhancing memory and storage solutions. Headquartered in Boise, Idaho, Micron serves customers worldwide with its memory and storage products. The company is recognized for its global reach and leadership in the semiconductor industry.
About micron
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Leadership Team
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
Unlock Company Insights
View leadership team, funding history,
and employee contacts for micron.
Salary
$80k – $108k
per year
More jobs at micron
Similar Jobs
Sr. Product Line Manager – Advanced Packaging & Metrology (E)
KLA
Technical Fellow, Advanced Packaging Integration
TechInsights
Packaging Module Development Engineer
Intel
Senior Director, Advanced Packaging Disruptive Technology
Applied Materials
Defect Metrology Process Development Engineer
SkyWater Technology Foundry, Inc.
MTS Packaging Engineer
GovernmentJobs