Micron Technology
The NCG Engineer – HBM Layout role at Micron Technology focuses on developing layout designs for High Bandwidth Memory (HBM) solutions used in artificial intelligence and high-performance computing applications. The position involves collaborating with global engineering teams to create and verify IC layouts while ensuring performance, power, and design efficiency standards are met. Candidates will work in a project-based environment, applying systematic problem-solving and physical verification techniques to support innovative semiconductor design.
Micron Technology, Inc. is a global leader in semiconductors, specializing in the design and manufacturing of memory and storage solutions including DRAM, NAND flash, HBM, and SSDs. The company serves a broad range of markets including AI and data centers, automotive, mobile, client PC, and industrial IoT. Headquartered in Boise, Idaho, Micron is recognized for its technology leadership and ongoing U.S. manufacturing expansion.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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