Optoelectronic Engineer

This role involves leading research and development in next-generation optoelectronic integration technologies to enable high-bandwidth electrical and optical interconnects and co-packaged optical systems. The position sits at the intersection of high-frequency electrical packaging, photonic integration, and advanced interconnect design to push the boundaries of performance and efficiency. The successful candidate will define integration architectures and co-package EICs, PICs, and advanced substrates while collaborating with Nokia Bell Labs researchers and business units.