skhynixamerica.com
SK hynix America is seeking a skilled Package Designer to join its Packaging Engineering team, responsible for designing and optimizing high-performance, high-density semiconductor packages for next-generation products. The role involves collaborating with cross-functional teams to deliver robust, manufacturable, and cost-effective package solutions while utilizing advanced EDA tools for layout and verification. This position focuses on developing innovative packaging technologies to support the company's leadership in the global AI revolution and semiconductor innovation.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for skhynixamerica.com.
44% above the average for this role