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Principal Package Design Engineer at Renesas 瑞萨电子 - ApplyBlast

Principal Package Design Engineer

Renesas 瑞萨电子

4 days ago

Tempe, Arizona, United States

Onsite

Full Time

Senior

0 applicants

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About this role

The Principal Package Design Engineer role involves designing and developing advanced package and interconnect methods for power SiP/modules, flip-chip LGA, and multi-chip modules. The position requires qualifying package technologies for consumer, industrial, and automotive power applications while collaborating with OSATs and contract manufacturers. The engineer will establish production controls, resolve process integration issues, and ensure smooth transitions into production with superior quality standards.

Responsibilities

Design and develop package and interconnect methods for power SiP and flip-chip LGA
Qualify package technologies and processes for consumer, industrial, and automotive applications
Resolve process integration issues and establish production controls for quality assurance

Skills

Qualifications

Doctorate in Physics, Chemistry, Mechanical, Electrical or Materials EngineeringMasters in Physics, Chemistry, Mechanical, Electrical or Materials EngineeringBachelor's Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering