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© All Rights Reserved. ApplyBlast.com
marvellsemiconductor.com
A High-speed IC Package Development Engineer at Marvell's Central Engineering team focuses on advanced microelectronic package designs that meet stringent electrical, thermal, and mechanical requirements. The role involves driving package development from concept to tapeout, utilizing complex design tools and architectures for multi-chip configurations and cutting-edge substrate materials. Collaboration with package architects, technical leads, and global teams is essential to ensuring manufacturability, performance, and cost compliance for data infrastructure and AI applications.
Headquarters
Santa Clara, California, United States
Company Size
1001-5000 employees
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for marvellsemiconductor.com.
Right around the average for this role