NVIDIA

Senior Package Layout Engineer

NVIDIA(5 months ago)

Taiwan, Hsinchu, TaiwanOnsiteFull TimeSenior$171,239 - $229,412 (estimated)Engineering
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About this role

A Senior IC Packaging Design Engineer at NVIDIA focuses on delivering and designing state-of-the-art high-speed interconnect systems and complex IC substrate layouts for supercomputers and datacenters. The role collaborates with technical package leads and cross-functional design teams to implement high-speed and PDN designs and optimize system-level pin assignments. It emphasizes developing methodologies to improve layout productivity, reliability, and schedule while working with APD/SiP and PCB layout tools.

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Required Skills

  • Package Layout
  • High-Speed Design
  • PDN Design
  • Substrate Layout
  • Routing
  • Placement
  • Stack-Up
  • Power Distribution
  • APD/SiP Tools
  • Signal Integrity

+9 more

Qualifications

  • B.Sc. Electrical Engineering
NVIDIA

About NVIDIA

nvidia.com

NVIDIA invents the GPU and drives advances in AI, HPC, gaming, creative design, autonomous vehicles, and robotics.

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