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© All Rights Reserved. ApplyBlast.com
marvellsemiconductor.com
Marvell is seeking a High-speed IC package development engineer to drive microelectronic package development from concept through tapeout within the Central Advanced Packaging organization. The role involves creating optimized C4 and BGA ball maps, managing netlist mappings, and defining die placement to ensure manufacturability and performance. Candidates will collaborate with architects and technical leads to select technologies and produce detailed Package Requirement Documents while adhering to complex design rules.
Headquarters
Santa Clara, California, United States
Company Size
1001-5000 employees
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for marvellsemiconductor.com.
18% above the average for this role