Packaging Engineer

This role involves partnering with businesses to design and develop semiconductor packaging technologies, including Wirebond, Flip Chip, and Modules, to enable differentiation for TI's analog and embedded processing products. The position requires participating in cross-functional teams to support product qualification, production, and reliability while conducting electrical, mechanical, and thermal models to predict and prevent high-risk designs. You will thrive in a fast-paced environment, utilizing strong prioritization and adaptability skills to solve problems through hands-on experiences.