Analog Devices Inc.
This role focuses on developing advanced packaging solutions for semiconductor devices, ensuring they meet demanding product requirements while balancing reliability, manufacturability, and cost. The position involves leading the design, development, and qualification of various packaging technologies, including wire-bond, flip-chip, and system-in-package solutions. It requires providing technical leadership in mechanical and thermal analysis to support package architecture selection and reliability risk assessment.
Headquarters
Wilmington, Massachusetts, United States
Company Size
10001+ employees
Founded
1965
Analog Devices, Inc. (ADI) is a global leader in the design and manufacturing of high-performance analog, mixed-signal, and digital signal processing (DSP) integrated circuits. The company focuses on addressing complex engineering challenges across various industries, providing innovative solutions that enhance functionality and efficiency. With a strong commitment to technological advancement, Analog Devices serves a vast array of markets, including communications, automotive, and healthcare, making it an essential player in the semiconductor and related device manufacturing sector. ADI is highly regarded for its quality, reliability, and industry expertise.
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
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