ApplyBlast uses AI to match you with the right jobs, tailor your resume and cover letter, and apply automatically so you can land your dream job faster.
© All Rights Reserved. ApplyBlast.com
ApplyBlast uses AI to match you with the right jobs, tailor your resume and cover letter, and apply automatically so you can land your dream job faster.
© All Rights Reserved. ApplyBlast.com
Qualcomm Incorporated
The engineer will be a key member of the Process Package Integration and bumping process team, driving technology development and new product introduction with primary ownership of wafer bumping process integration and qualification. The role involves defining process flows, establishing controls, and partnering with suppliers to improve yield, reliability, and cost across multiple silicon technology nodes and assembly houses. This position requires leading bumping house bring-up and qualification to expand capacity and ensure multi-source readiness for advanced packaging solutions.
Headquarters
San Diego, California, United States
Company Size
10001+ employees
Founded
1985
Qualcomm is a global semiconductor and telecommunications company that designs wireless technologies and platform solutions, best known for its Snapdragon mobile SoCs, 5G modems, and RF front‑end components. The company focuses on high‑performance, low‑power computing and on‑device AI, as well as unrivaled connectivity to enable smartphones, automotive systems, XR, IoT, and edge applications. Qualcomm pairs chip design and system software with extensive patent licensing and a broad OEM/developer ecosystem to accelerate industry transformation through 5G, AI, and “intelligent computing everywhere.”
Headquarters
San Francisco, CA
Company Size
201-500 employees
Founded
2018
Industry
Technology
Glassdoor Rating
4.2 / 5
Sarah Johnson
Chief Executive Officer
Michael Chen
Chief Technology Officer
Emily Williams
VP of Engineering
David Rodriguez
VP of Product
Jessica Thompson
Chief Financial Officer
Andrew Park
VP of Sales
View leadership team, funding history,
and employee contacts for Qualcomm Incorporated.
Senior/Staff Process Engineer (Wafer Bumping/Fan-Out)
Lumilens
Senior/Staff Process Engineer (Wafer Dicing & Back-grind)
Lumilens
Staff Integration Engineer
aosmd
Packaging & Testing Engineer
ASTARPRD
Process Integration Program Engineer
Micron Technology
Senior/Staff STPG Engineer Product Engineering - Probe
Micron Technology